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Low melting point solder plating - List of Manufacturers, Suppliers, Companies and Products

Low melting point solder plating Product List

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Lead-free low melting point solder plating

Lead-free low melting point solder plating

Low-temperature mounting is possible for weak heat-resistant materials such as PET.

By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - The Bi content (20-60 wt%) can be controlled by changing the usage conditions. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】Dainting Alloy I - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.

  • Chemicals
  • Solder

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Lead-free low melting point solder plating

Lead-free low melting point solder plating

Low-temperature mounting on weak heat-resistant materials such as PET is possible.

By using low melting point solder, energy consumption during reflow can be reduced, thereby lowering environmental impact. Plating allows for implementation on patterns and small components. 【Sn-Bi Alloy Plating】DAINTINGOOD 503 - Low melting point (approximately 140°C) Sn-Bi alloy. - By changing the usage conditions, the Bi content (20-60 wt%) can be controlled. - Plating can be performed with relatively high current efficiency. 【Sn-In Alloy Plating】DAINTINGOOD 511 - Low melting point (approximately 120°C) Sn-In alloy. - A white, non-glossy film with an In content of 50-70% can be obtained. - Plating can be performed with relatively high current efficiency.

  • Chemicals
  • Solder
  • Other electronic parts

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Low melting point solder plating (melting point 60~110℃)

Low melting point solder plating (melting point 60~110℃)

Developed a solder plating that can be adjusted to a melting point of 60 to 110℃!!

Low heat-resistant materials have issues of "distortion, misalignment, and reduced characteristics" due to the heat during implementation (reflow). With the newly developed low-melting-point solder plating, the melting point can be selected in the low temperature range of 60 to 110°C to match the heat resistance of the target materials. This allows for implementation without damage or alteration. <Examples of applications> - PZT (piezoelectric elements) - CdTe (cadmium telluride) - Resin materials (such as PET) - micro LED (LTPS) etc... for implementation solder.

  • Wafer
  • Sensors
  • EMS

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